With over 20 years of experience in the electronics industry, we bring your projects to life with the highest precision and care – combined with a dynamic workflow.
Our strength lies in the ability to adapt flexibly to your requirements and accelerate time-to-market – without compromising on quality.
Our technical advisory supports you through every phase of production – from project analysis to final product delivery – while optimizing your design for performance and manufacturing efficiency.
We apply solder paste with surgical precision – micron-level accuracy for perfect SMD component placement.
Our automated systems deliver flawless, consistent deposition to optimize your soldering results.
Next-gen 3D inspection verifies every detail of your solder paste deposits.
Using advanced scanning technology, we guarantee:
✓ Perfect volume distribution
✓ Ideal paste height profile
✓ Flawless component alignment
– ensuring 100% reliable electrical connections.
Automated Precision Component Placement. Our advanced systems: Identify components from reels with vision accuracy; Place SMDs with micron-level precision; Prepare perfect solder-ready positioning.
Controlled thermal process that completes the assembly. The calibrated thermal profile ensures perfect soldering between components and pads, guaranteeing electrical and mechanical integrity of the circuit.
The AOI (Automated Optical Inspection) machine is an automated system that uses computer vision to inspect products—particularly printed circuit boards—for defects and to ensure the highest quality.
The machine can detect all the typical defects found on a post-soldering board, maintaining a level of repeatability that a human operator cannot guarantee over time.
Advanced interconnect technologies: hybrid assembly solutions for high-performance & specialized components. L’assemblaggio PTH integra i nostri processi SMD quando necessario, creando soluzioni ibride ottimizzate per massimizzare performance e affidabilità.
When required, our PTH (Plated Through-Hole) assembly complements SMT processes to create hybrid solutions engineered for:
Controlled thermal process to complete PCB assembly:
• Calibrated temperature profile ensures perfect solder joints
• Secures electrical & mechanical circuit integrity
• Optimized pad-to-component bonding
Precision technology with advanced parametric control. Each solder joint is individually programmed. Accurate calibration of solder volume & time parameters to create flawless electrical connections – even with complex geometries.
Aesthetic and functional protection realised in synergy with Cherubini Group companies. Surface treatments guarantee environmental resistance and increase the durability of the circuits in the harshest operating conditions.
Vertical integration from component to finished product.
We manage the entire electromechanical assembly process, combining wiring, assembly and electronic integration with full functional testing, delivering market-ready products.
Meticulous attention to the finest detail.
Each product is packed and labelled according to customised specifications and in accordance with the agreed logistical arrangements, in order to preserve product integrity.
Cherubini S.p.A. | P.Iva IT 00622080984 |